Project leader
STARCHIPPartners
MORPHO, SMART PACKAGING SOLUTIONS, DOLPHIN INTEGRATION, Aix Marseille Université (IM2NP), INP Grenoble (TIMA)Funders
FUI,
LISA
Ultra Low power Integrated circuit for Secure RF Applications
ultra Low power Integrated circuit for Secure RF Applications
The contactless / dual interface market is growing in the three main areas of transport, identity & banking. The ergonomics, the form factor and the performance of the solutions used remain crucial issues for the acceptance by the users of the deployed offers and outside the telecommunications field the problem remains for the other sectors which are important markets and established, and will become even more acute (form factor) in the emerging markets of smart objects.
Based on this finding StarChip IC and SPS have developed a common patent with a concept to improve the performance of dual interface cards. Thus, the LISA project (8.8 M ‘, 42 months) proposes to finalize this process and develop contactless objects, based on a new RF module (13.56 Mhz / 10 cm range). Its main objective is to reduce the energy needs of current solutions with equal performances. This RF module can be integrated in a smart card to address all established markets (Banking, Identity, Transport) or other types of format.
Comprised of industry leaders in their market (Morpho StarChip®, SPS, Dolphin) and leading laboratories have developed a strong expertise (IM2NP and TIMA), the project is strategic for the field of security and Morpho will be the first user of LISA products.
In line with the strategy and the main areas of SCS Poles and MINALOGIC, this project will not only strengthen the partnership between the partners of the two poles but also put forward a task French RF power on the sector “secure contactless object” .