Project directory

I2FLEX

Printed Integration on FLEXible media.

The MICROPOLY program financed by the European Social Fund and the DGCIS for the period 2006-2009 made it possible to have a unique material jet printing system (JETPAC) integrating a multi-function online process: surface preparation, laser ablation, inkjet, ovens. This system is operational on the Micro-PackS / CIMPACA technology platform. The strategy of the I2FLEX consortium, relying on the platform and on the mining school is to valorize the printed electronics technology already acquired, by removing technological barriers to: – Develop a hybrid approach between chips and electronics printed on low-temperature substrates (paper, teslin, PC, PET) – Developing components made to order in printed electronics in order to integrate flexible, low-cost support systems for the smart label die (RFID tag), autonomous / smart sensor and smart card.

The objective of the I2FLEX project, is to achieve largely by jet of material, at the request of the industrial partners, communicating objects low cost. For this, it is necessary to make the sources of the “disposable” materials and the processes for the heterogeneous interconnection on a flexible support of a multi-component silicon / printed electronics module reliable.

This project will offer a hybrid alternative to the “roadmap” of the “Organic electronics association” for 100% printed objects planned in 2018 and beyond.

The overall goal is to demonstrate the feasibility of these technologies as a means of production for a new generation of low-cost smart objects, both in terms of technical performance and economic performance of manufacturing processes.

In the context of the I2FLEX project, the aim is to prove the maturity of technologies by developing demonstrators:

– smart card with advanced function

– Self-contained smart tags with HF (NFC) or U-HF contactless reading

and to establish a feedback of experience for the prefiguration of a manufacturing pilot line.