Project leader
ST MicroelectronicsPartners
Gemalto, Alcatel AMMS, Beamind, Fogale, CEA-LETI, ENSMSEFunders
FUI,
SMARTSTACK (ex-TRAVIATA)
3D circuit integration (3D IC) whose chip chip connections are provided by vias through silicon.
| Themes | Markets | R&D Investment | Duration | Funding Year |
|---|---|---|---|---|
|
Microelectronics |
Other |
5526 K€ | 24 months | 2008 |
Themes
Microelectronics
Markets
Other
R&D Investment
5526 K€
Duration
24 months
Funding Year
2008